No Need Preheating Pink Thermal Phase Change Interface Material For Notebook
The TIC™808P Series is low melting point thermal interface material. At 50℃, The TIC™808P Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™808P Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™808P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
Features:
> 0.024℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Applications:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
| Typical Properties of TIC™808P Series |
| Product Name | TICTM808P | Testing standards |
| Color | Pink | Visual |
| Composite Thickness | 0.008"
(0.203mm) | |
| Thickness Tolerance | ±0.0008"
(±0.019mm) | |
| Density | 2.2g/cc | Helium Pycnometer |
| Work temperature | -25℃～125℃ | |
| phase transition temperature | 50℃~60℃ | |
| Thermal conductivity | 0.95 W/mK | ASTM D5470 (modified) |
| Thermal lmpedance @ 50 psi(345 KPa) | 0.053℃-in²/W | ASTM D5470 (modified) |
| 0.34℃-cm²/W |
Standard Thicknesses:
0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.
Standard Sizes:
9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series products.
Reinforcement:
No reinforcement is necessary.
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No Need Preheating Pink Thermal Phase Change Interface Material For Notebook 0.95 W/mK Images
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