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Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W

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Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W

Name: Low Melting Point Thermal Phase Changing Materials 095 W mK with 0024in W
Brand: Ziitek
Price: 1 USD

China Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W wholesale

Brand Name : Ziitek

Model Number : TIC™803Y series

Certification : RoHs

Place of Origin : China

MOQ : 1000PCS

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bay

Product Name : Phase Changing Materials

Color : Yellow

Thermal Conductivity : 0.95 W/mK

Density : 2.2g/cc

Temperature range : -25℃～125℃

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Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W

The TIC™803Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

The TIC™803Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W

Features:

No heat sink preheating required

Low thermal resistance

Ease of use for high volume manufacturing

High thixotropic index

Dry to the touch for pre-apply applications

High thermal reliability, minimal pump out

Re-flow compatible

Cost Effective

Used where electrical isolation is not required

Low volatility – less than 1%

Easy to handle in the manufacturing environment

Flows but doesn’t run like grease

Available in custom die-cut shapes, kiss-cut on rolls

Applications:

> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

> Telecommunication

Typical Properties of TIC™800Y Series
Product Name	TIC^TM803Y	TIC^TM805Y	TIC^TM808Y	TIC^TM810Y	Testing standards
Color	Yellow	Yellow	Yellow	Yellow	Visual
Composite Thickness	0.003" (0.076mm)	0.005" (0.126mm)	0.008" (0.203mm)	0.010" (0.254mm)
Thickness Tolerance	±0.0006" (±0.016mm)	±0.0008" (±0.019mm)	±0.0008" (±0.019mm)	±0.0012" (±0.030mm)
Density	2.2g/cc				Helium Pycnometer
Work temperature	-25℃～125℃
phase transition temperature	50℃~60℃
Thermal conductivity	0.95 W/mK				ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)	0.021℃-in²/W	0.024℃-in²/W	0.053℃-in²/W	0.080℃-in²/W	ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)	0.14℃-cm²/W	0.15℃-cm²/W	0.34℃-cm²/W	0.52℃-cm²/W	ASTM D5470 (modified)

Standard Thicknesses:

0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:

No reinforcement is necessary.

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Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W

Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W

thermal insulating materials

heat sensitive materials

Phase Changing Materials 0.95 W / mK

Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W Images